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粘片机 - 晶圆级封装

帕洛马技术3500 III执行全自动晶圆级封装和先进的微电子组装。这是一个高度灵活的系统,可以执行3个通道的胶粘剂点胶,如组件放置操作,共晶芯片连接(稳态和脉冲热共晶键合),各地在工作区的710平方米倒装芯片。

Palomar Technologies Model 3500-III performs fully automatic wafer scale packaging and advanced microelectronics assembly. This is a highly flexible system that can perform up to 3 channels of adhesive dispense, and operations such as component placement, eutectic die attach (steady state and pulse heat eutectic bonding), flip chip all over a 710 sq in work area.

0.74117612838745 s